使用法
構造, パッキング, Chip UV Adhesive
Product name
Chip UV Adhesive
Material
One-component potting materials
Storage temperature
-20-8℃
Use
Low temperature fast curing
Product Description
Suitable for low-temperature curing of heat-sensitive components
Curing system
Heat cured or UV cured
Feature
High temperature stability and heat shock resistance
Glue type
Epoxy resin-based