適用産業
機械修理店, 家庭, Welding repair equipment
使用法
Mobile phone (Mini) BGA/IC Rework and Repair
PCB size
450x390mm Min10x10mm
Overall dimension
L650xW630xH850mm
Usage
Repair Chips, iphones motherboard etc.
Warranty
3 years ( 1st year is free )
Certification
CE ISO certification
Available BGA Chip
Max 70*70mm Min 1*1 Mm
Advantage
High Speed Stability