タイプ
Thermally Conductive Compound
使用法
Thermally Conductive Compound for the cooling of MPU in servers, desktops, notebooks, and game consoles
MF
Thermally Conductive Compound
EINECS番号
Thermally Conductive Compound
Viscosity At Low Strain Rate
1,200 Pa-s
Viscosity At High Strain Rate
100 Pa-s
Thermal Conductivity
5.2 W/mK