銘柄
Yuwei Electronic Technology Co., Limited
SMT Production Capacity
8.5 million solder joints per day
Min. IC Pitch
03015 Chip/0.35 Pitch BGA
Minimum Component accuracy
±0.04mm
IC assembly precision
±0.03mm
Assembly PCB size
50*50mm - 774*710mm
Assembly PCB Thickness
0.3-6.5mm
Payment
L/C,T/T,Western Union,MoneyGram