使用法
構造, パッキング, TV and Camera
その他の名前
One-component potting epoxy underfill adhesive
タイプ
One-component potting epoxy underfill adhesive
Product name
One-component potting epoxy underfill adhesive
Curing method
Low temperature curing
Product Description
High Tg, rapid curing, low viscosity
Curing system
Fast curing at low temperature
Application scenario
Chip bottom filling
Curing conditions
10min @ 130℃