モデル番号
Hot Sale ACHI IR-6500 BGA Reball Machine
使用法
BGA soldering and desoldering
Consumption of upper heating
400W
Consumption of bottom heating
800W
Size of upper heating
80mm X 80mm
Size of bottom heating
180 mm X180mm
Size of applicable chips
≤70mm X 70mm
Size of applicable PCB
≤400mm X 305mm
Dimension of machine
L 475mm X W480mm X H 420mm