Min. Line Width
1/2 oz. copper .003" +/- .0005" (0.0762mm)
Copper Thickness
1/3oz ~6oz
Min. Line Spacing
1/2 oz. copper .003" +/- .0005" (0.0762mm)
Base Material
FR-4,Hi-TG FR4,CEM-1,CEM-3, TACONIC, Metal/ceramic/aluminum base
Base, Cover film, Stiffeners thickness:
0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um
BGA Ball Pitch
1mm ~ 3mm(4mil ~ 12mil)
Hi-TG FR4 Material
Tg-130 Tg-140 Tg-160 Tg-170
PCB Assembly Method
SMT, Through-hole, Mixed, BGA